Influence of Electroless Ni-P Film Condition on Wire Bondability
نویسندگان
چکیده
منابع مشابه
Electroless Ni–P composite coatings
This review outlines the development of electroless Ni–P composite coatings. It highlights the method of formation, mechanism of particle incorporation, factors influencing particle incorporation, effect of particle incorporation on the structure, hardness, friction, wear and abrasion resistance, corrosion resistance, high temperature oxidation resistance of electroless Ni–P composite coatings ...
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Abstract:Electroless Nickel-phosphorus (EN) coatings provide high performance in various industrial fields due to their unique properties such as excellent corrosion and wear resistance. This paper aims to study the effect of ZnO nano-particles addition on corrosion behavior of EN coatings. Various amounts of ZnO nano-particles with average diameter of 50 nm were added to hypophosphite reduced ...
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Electroless Ni-P (EN) plating, as an important group of metallic coatings, employed in a wide range of industrial applications. The current work aims to investigate the effects of pretreatment process before EN plating on fatigue behavior of SAE 1045 steel. The specimens of rotating bending fatigue test were prepared from the steel in two series. A group of samples used in as-polished con...
متن کاملThe Preparation, Characterization, and Influence of Multiple Electroless Nickel-Phosphorus (Ni-P) Composite Coatings on Poplar Veneer
Nickel-Phosphorus (Ni-P) composite coatings were prepared on a poplar veneer surface via a simple electroless nickel (Ni) approach. The substrate deformation, flatness, crystalline structure, and wear resistance of the NiP composite coatings were investigated. The deformation degree of the substrate decreased as the number of deposition steps was increased. The flatness and wear resistance of t...
متن کاملInvestigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...
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ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2011
ISSN: 0915-1869
DOI: 10.4139/sfj.62.47